Research & Development
We specialize in offering novel solutions to difficult problems, specializing in harsh environment electronics with extensive experience in PCB design for extreme environments, from deep underground to miles above the earth.
Electronic PCB Design
We build custom electronic circuitry.
Embedded Design
We provide electronics and software custom microcontroller applications.
FPGA Design
We do VHDL and schematic capture for embedded projects.
Reverse Engineering
We can duplicate and document the functionality of existing electronics hardware.
Refactoring & Legacy Code Maintenance
We update and clean up old electronics hardware projects.
Case Study: Data Acquisition Electronics
The Challenge: A data acquisition unit that our client depended on for telemetry measurements went obsolete. The unit had to meet strict requirements: fit within tight physical dimensions, operate in a harsh environment (high vibration, high temperature, and extremely low pressure), and consume low power. The unit had to sample and store multiple megabytes of data that was easily and quickly, retrieved and viewed on a standard PC.
The Solution: Zebisoft utilized its experience in PCB design for extreme environments and delivered a custom-built electronics package, containing a microprocessor, a microSD memory card, and various analog sensors. The microprocessor software was real-time and stored data on the SD card in a PC readable format. After a successful installation and commercial use, data retrieval and analysis illustrated the product performed to expectation.
Case Study: FPGA Design
The Challenge: Our client requested the design of a proprietary circuit for a data processing algorithm. The design had to meet strict requirements: size and speed constraints.
The Solution: Zebisoft utilized its experience in FPGA design and delivered an optimized, high-speed design after extensive research into fundamental FPGA circuit behavior. The novel design improved the overall throughput by a factor of 256 while still fitting in the original package and resulted in multiple patent applications.
